Small industrial electronic imaging camera

ABSTRACT

A box-type camera housing having a four-piece structure which allows an external interface connector to be provided in an arbitrary face among five faces except a front face is configured by a lens mount, a board mount frame, a tri-face cover, and a connector metal bracket attached with an external interface connector. In addition, the camera functions are integrated by containing, in an imaging chamber in the camera housing, a control board for controlling a sensor substrate and a power supply board for controlling supply of an operation power for the sensor board and control board, in addition to a sensor board.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a Continuation Application of PCT Application No. PCT/JP2010/072800, filed Dec. 17, 2010 and based upon and claiming the benefit of priority from prior Japanese Patent Application No. 2009-296194, filed Dec. 25, 2009, the entire contents of all of which are incorporated herein by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a small industrial electronic imaging camera comprising a connection mechanism for connecting an external interface cable, which is preferably applied to a machine vision system.

2. Description of the Related Art

In a small electronic imaging camera having a box type housing structure having edges which are, for example, about 20 to 30 mm long, i.e., a so-called microcamera in a machine vision system, a large pace is occupied by external interface connectors in the housing, and therefore, there is a difficulty in maintaining spaces for mounting external interface connectors at a plurality of portions in the housing. An external interface connector is therefore provided and fixed to one portion of the housing. A specific example will be an external interface connector provided in a back face (rear face) part of a box-type camera housing in a manner that an external interface cable is led from a back face (rear face) of the box-type camera housing. Therefore, according to the prior art, the external interface cable has to be led in one leading direction, and the leading direction of the cable cannot be changed. Therefore, for example, a degree of freedom is insufficient for changing camera configuration settings, such as changes to mount positions, a change of a monitor target, and changes to a camera configuration. Further, a position where the external interface connector is attached is fixed, and cause a problem in general versatility of products. Further, in order to simplify a connection. configuration of an external interface cable (or to integrate camera functions), the aforementioned small electronic imaging camera called a microcamera is demanded to have a mount structure which contains, in one single camera housing, each of a control board for controlling a sensor board and a power supply board for controlling supply of an operation power for the control board, in addition to a sensor board where a solid-state imaging element (area image sensor) is mounted. However, the small electronic imaging camera called a microcamera having the box-type housing structure, an imaging chamber formed in the camera housing is very narrow, and there is a difficulty in maintaining a mount space for containing the aforementioned control board and power supply board.

There is a video camera in which a connector pivot mechanism which can be pivoted about two axes perpendicular to an exterior housing is provided as a variable mechanism which can change a cable leading direction of a camera so as to provide a degree of freedom for a cable connection direction of a connector (see Patent Literature 1). Although the video camera provided with the connector pivot mechanism allows the cable leading direction to be changed, a mechanism which pivotally supports a connector provided with wires is complex and causes a problem in economy and reliability. When the video camera is applied to a microcamera having a box-type structure as described above, there is a difficulty in maintaining mount spaces. Further, even if leading directions of the cable are changeable, mounting parts of the connector are fixed to predetermined positions of the housing, and cause a problem in the degree of freedom and the general versatility as described above.

Citation List Patent Literature

PTL 1: Jpn. Pat. Appln. KOKAI Publication No. 5-207342

BRIEF SUMMARY OF THE INVENTION Technical Problem

As has been described above, a prior art small electronic imaging camera for a machine vision has a poor degree of freedom in changing settings of a camera environment and causes a problem in general versatility as a product. Further, there are difficulties in mounting, in a camera housing, a plurality of circuit boards, such as a control board and a power supply board, in addition to a sensor board in order to integrate camera functions.

The present invention. has been made in view of situations described above.

Solution to Problem

One embodiment of the present invention is a small industrial electronic imaging camera comprising:

a box-type camera housing having a hexahedral structure in which an external interface connector can be attached to an arbitrary face part among a plurality of face parts except a front face part at which a lens mount is formed;

a sensor board which is contained in an imaging chamber formed in the camera housing and mounts a solid-state imaging element;

a control board which is contained in the imaging chamber and controls driving of the solid-state imaging element mounted on the sensor board; and

a power supply board which is contained in the imaging chamber and controls supply of an operation power to the sensor board and control board, wherein

the control board and the power supply board form a POP (package on package) board having a double board structure in which the control and power supply boards are integrally connected and circuited to each other by soldering by a plurality of resin core solder balls having a columnar shape whose center part swells, with a predetermined gap maintained between mutually opposed board faces of the control and power supply boards

Another embodiment of the present invention is a small industrial electronic imaging camera having the camera housing which comprises:

a lens mount which comprises an imaging window and forms the front face part of the box-type camera housing having the hexahedral structure;

a tri-face cover having a rectangular U-shaped cross-section which can be attached to the lens mount with edges switched in relation to edges of the lens mount about a vertical axis parallel to an optical axis of the imaging window, and forms arbitrary three side face parts of the camera housing or forms arbitrary two side face parts and a back face part of the camera housing;

a board mount frame which comprises a board mount mechanism containing and supporting a plurality of boards in an imaging chamber formed in the camera housing, and is attached to the lens mount thereby forming an arbitrary face part, of the camera housing;

a connector metal bracket which is attached to the lens mount and forms an arbitrary side face part or the back face part of the camera housing; and

an external interface connector which comprises an external connection terminal for connecting an external interface cable, and is attached to the connector metal bracket, with the external connection terminal exposed to outside of the housing, wherein

the sensor board is supported by the lens mount;

the POP board is supported by the board mount mechanism, and the sensor board and the POP board are contained in the imaging chamber.

A further embodiment of the present invention is a small industrial electronic imaging camera, wherein, in the POP board, an active circuit component is mounted on one of the mutually opposed board faces, and a predetermined clearance is formed by the resin core solder balls between an upper face of the active circuit component and the other one of the mutually opposed board faces.

A still further embodiment of the present invention is a small industrial electronic imaging camera, wherein, on the POP board, the resin core solder balls are provided on both sides of the active circuit component, and the gap forms a waste heat path which guides heat generated from the active circuit component to the resin core solder balls.

Advantageous Effects of Invention

According to the invention, there is provided a small industrial electronic imaging camera comprising a connection mechanism for an external interface cable with high general versatility, wherein the camera can be easily assembled with a leading direction of the external interface cable arbitrarily selected, in an economically advantageous configuration. Further, there is provided a small industrial electronic imaging camera which can integrate camera functions by containing, in an imaging chamber in a camera housing, a control board for controlling a sensor board, and a power supply board for supplying and controlling an operation power for the sensor board and control board, and can be expected to achieve highly reliable circuit operation.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING

FIG. 1 is an exploded perspective view showing a camera assembly structure according to an embodiment of the invention where an external interface cable is led from a back face part of a housing;

FIG. 2 is a perspective view showing a part of the camera assembly structure according to the embodiment, where the external interface cable is led from a side face part (upper face part/lower face part/left face part/right face part) of the housing (an assembly structure except a lens mount built-in module);

FIG. 3A is a side cross-sectional view showing the camera assembly structure (assembled) shown in FIG. 1;

FIG. 3B is a perspective view showing a part of the camera assembly structure (assembled) shown in FIG. 1;

FIG. 4A is a side cross-sectional view showing the camera assembly structure (assembled) shown in FIG. 2;

FIG. 4B is a perspective view showing a part of the camera assembly structure (assembled) shown in FIG. 2;

FIG. 5A is a perspective view showing a camera assembly structure and a built-in state where the external interface cable is led from a back face part of the housing, according to the embodiment;

FIG. 5B is a perspective view showing an exterior configuration of a camera assembly structure (assembled) where the external interface cable is led from the back face part of the housing, according to the embodiment;

FIG. 6A is a perspective view showing a camera assembly structure and a built-in state where the external interface cable is led from an upper face part of the housing, according to the embodiment;

FIG. 6B is a perspective view showing an exterior configuration of a camera assembly structure (assembled) where the external interface cable is led from the upper face part of the housing, according to the embodiment;

FIG. 7A is a perspective view showing a camera assembly structure and a built-in state where the external interface cable is led from a lower face part of the housing, according to the embodiment;

FIG. 7B is a perspective view showing an exterior configuration of a camera assembly structure (assembled) where the external interface cable is led from the lower face part of the housing, according to the embodiment;

FIG. 8A is a perspective view showing a camera assembly structure and a built-in state where the external interface cable is led from a left face part of the housing, according to the embodiment;

FIG. 8B is a perspective view showing an exterior configuration of a camera assembly structure (assembled) where the external interface cable is led from the left face part of the housing, according to the embodiment;

FIG. 9A is a perspective view showing a camera assembly structure and a built-in state where the external interface cable is led from a right face part of the housing, according to the embodiment;

FIG. 9B is a perspective view showing an exterior configuration of a camera assembly structure (assembled) where the external interface cable is led from the right face part of the housing, according to the embodiment;

FIG. 10A is an exploded perspective view showing for explaining an assembly procedure where the external interface cable is led from a back face part of the housing, according to the embodiment;

FIG. 10B is an exploded perspective view showing for explaining the assembly procedure where the external interface cable is led from the back face part of the housing, according to the embodiment;

FIG. 11A is an exploded perspective view showing for explaining the assembly procedure where the external interface cable is led from the back face part of the housing, according to the embodiment;

FIG. 11B is an exploded perspective view showing for explaining the assembly procedure where the external interface cable is led from the back face part of the housing, according to the embodiment;

FIG. 12A is an exploded perspective view showing for explaining the assembly procedure where the external interface cable is led from the back face part of the housing, according to the embodiment;

FIG. 12B is a perspective view showing an exterior configuration of a camera assembly structure (assembled) where the external interface cable is led from the right face part of the housing, according to the embodiment;

FIG. 13A is an exploded perspective view showing for explaining an assembly procedure where the external interface cable is led from a face part of the housing (upper face part/lower face part/left face part/right face part), according to the embodiment;

FIG. 13B is an exploded perspective view showing for explaining the assembly procedure where the external interface cable is led from the face part of the housing (upper face part/lower face part/left face part/right face part), according to the embodiment;

FIG. 14A is an exploded perspective view showing for explaining the assembly procedure where the external interface cable is led from the face part of the housing, according to the embodiment;

FIG. 14B is an exploded perspective view showing for explaining the assembly procedure where the external interface cable is led from the face part of the housing, according to the embodiment;

FIG. 15 is an exploded perspective view showing for explaining the assembly procedure where the external interface cable is led from the face part of the housing, according to the embodiment;

FIG. 16 is a perspective view for schematically explaining a POP board, according to the embodiment;

FIG. 17A is a perspective view showing a structure of a main part of a POP board, according to the embodiment; and

FIG. 17B is a side view showing another example structure of the main part of the POP board, according to the embodiment.

DETAILED DESCRIPTION OF THE INVENTION

Hereinafter, an embodiment of the invention will be described with reference to the drawings.

FIGS. 1, 2, 3A, and 4A show a camera assembly structure of a small industrial electronic imaging camera according to an embodiment of the invention. FIG. 1 (exploded perspective view) and FIG. 3A (side cross-sectional view) show the assembly structure when an external interface connector is provided at a back face part (rear face part) of a box-type camera housing having a hexahedral structure, to lead an external interface cable from the back face part of the box-type camera housing. FIG. 2 (partial exploded perspective view) and FIG. 3A (side cross-sectional view) show an assembly structure when an interface connector is provided at an arbitrary side face part (any one of upper, lower, left, and right face parts) of the box-type camera housing, to lead an external interface cable from the side face part of the box-type camera housing. In the following, the camera assembly structure shown in FIGS. 1 and 3A will be referred to as a back cable lead assembly structure, and the camera assembly structure shown in FIGS. 2 and 4A will be referred to as a side cable lead assembly structure.

As shown in FIGS. 1, 2, 3A, and 4A, the small industrial electronic imaging camera according to the embodiment of the present invention comprises a lens mount 10, a tri-face cover 30, a board mount frame 20, a connector metal bracket 40, and an external connection terminal 51. The lens mount 10 comprises an imaging window 101 and forms a front face part of the box-type camera housing 1 having a hexahedral structure. The tri-face cover 30 having a rectangular U-shaped cross-section can be attached to the lens mount 10, with edges of the tri-face cover 30 switched relatively to edges of the lens mount 10 around a vertical axis parallel to an optical axis O1 of the imaging window 101. The tri-face cover 30 forms arbitrary three side faces or two side faces and a back face of the camera housing 1. The board mount frame 20 comprises a board mount mechanism 205 which contains and supports a plurality of boards in an imaging chamber 2 formed in the camera housing 1. The board mount frame 20 is attached to the lens mount 10 and forms an arbitrary side face of the camera housing 1. The connector metal bracket 40 is attached to the lens mount 10 and thereby forms an arbitrary side face of the camera housing 1 or a back face of the camera housing 1. The external interface connector 50 comprises an external connection terminal 51 for connecting an external interface cable, and is attached with the connector metal bracket 40 with the external connection terminal 51 exposed to outside.

The lens mount 10, the board mount frame 20, the tri-face cover 30, and the connector metal bracket 40 attached with the external interface connector 50, which are constitutive elements of the box-type camera housing 1, are components forming the housing, which are common to both the back cable lead assembly structure and the side cable lead assembly structure, The box-type camera housing 1 having a four-piece structure according to the embodiment of the present invention, in which an external interface connector can be provided in an arbitrary face among five faces except the front face, can be constructed by the lens mount 10, board mount, frame 20, the tri-face cover 30, and the connector metal bracket 40 attached with the external interface connector 50.

Between the back cable lead assembly structure shown in FIGS. 1 and 3A and the site cable lead assembly structure shown in FIGS. 2 and 4A, as is apparent from comparison between the figures, directions of an external connection terminal 502 led from a connector terminal lead hole 403 are vertically reversed to each other in relation to the connector metal bracket 40 as shown in FIGS. 3B and 4B, Accordingly, a direction of a terminal array of a connection end surface 503 of an external connection terminal 502 is reversed as well.

In the box-type camera housing 1 according to the embodiment of the invention, a cable connection direction of the external connection terminal 502 provided on the external interface connector 50 is perpendicular to the optical axis O1 (i.e., a connection end surface 503 of the external connection terminal 502 is parallel to the optical axis O1), in the back cable lead assembly structure in which the connector metal bracket 40 forms the back face part of the camera housing 1. In the side cable lead assembly in which the connector metal bracket 40 forms any of the right, left, upper, and lower face parts of the camera housing 1, the cable connection direction of the external connection terminal 502 is perpendicular to the optical axis O1 (i.e., the connection end surface 503 of the external connection terminal 502 is parallel to the optical axis O1).

In the back cable lead assembly structure in which the connector metal bracket 40 forms the back face part of the camera housing 1, the connector metal bracket 40 is fixed with screws to the lens mount 10 through the board mount frame 20 and is also fixed with screws to the lens mount 10 through the tri-face cover 30, as shown in FIGS. 1 and 3A. In the side cable lead assembly in which the connector metal bracket 40 forms any of the right, left, upper, and lower face parts of the camera housing 1, the connector metal bracket 40 is fixed directly to the lens mount 10 and is fixed with screws to the lens mount 10 through the tri-face cover 30 and board mount frame 20, as shown in FIGS. 2 and 4A. Screws T used for the fixing with screws are partially omitted from the figures.

The lens mount 10 is configured to comprise a lens frame part 102 and screw fixing pieces 104, 105, 106, and 107. The lens frame part 102 is added with a top mark 103 around an imaging window 101 in a face part exposed to outside. The screw fixing pieces are provided at corners on four edges of the back face part, and each comprise two screw holes (threaded holes) which are parallel to two edges perpendicular to each other. The lens mount 10, the board mount frame 20, the tri-face cover 30, and the connector metal bracket 40 attached with the external interface connector 50 are fixed with screws to each other through the eight screw holes in the fixing pieces 104, 105, 106, and 107. In this manner, the assembly structures of the box-type camera housing 1 are formed with the imaging chamber 2 formed therein. The top mark 103 always clearly indicates up and down directions of imaging planes (described later) of a solid-state imaging element for the assembly structures. The top mark 103 is cut in the lens frame part 102.

The board mount frame 20 comprises two engaging pieces 202 and 203, two screw fixing pieces 201 and 204, and a board fixing piece 205. The two engaging pieces 202 and 203 each comprise a face part exposed to outside where a nameplate is bonded, and comprise a back face part where a screw insertion hole is cut. Two screw fixing pieces 201 and 204 respectively comprise screw holes (threaded holes). The board fixing piece 205 forms the board mount mechanism. The engaging piece 202 is provided at a corner on an edge a in a side of an edge b, and the engaging piece 203 is provided at a corner on an edge c in a side of the edge b. Screw fixing holes are cut in a direction parallel to the edge b in the engaging pieces 202 and 203. The screw fixing piece 201 is provided at a corner on an edge d in a side of the edge c. A screw hole in a direction perpendicular to the edge a is cut in the screw fixing piece 201, and a screw hole in a direction perpendicular to the edge d is cut in the screw fixing piece 204. The board fixing piece 205 is provided on the edge a, and a screw hole is provided in a direction parallel to the edge a.

The screw fixing piece 201 engages with a screw fixing hole 315 in the tri-face cover 30 in the back cable lead assembly structure, and engages with the screw fixing hole 315 in the tri-face cover 30 in the side cable lead assembly structure. The engaging piece 202 is fixed with screws to a screw fixing piece 107 in the lens mount 10 in the back cable lead assembly structure, and is fixed with screws to a screw fixing piece 105 in the lens mount 10 in the side cable lead assembly structure. The engaging piece 203 is fixed with screws to a screw fixing piece 106 in the lens mount 10 in the back cable lead assembly structure, and is fixed with screws to a screw fixing piece 104 in the lens mount 10 in the side cable lead assembly structure. The screw fixing piece 204 engages with a screw fixing hole 411 in the connector metal bracket 40 in the back cable lead assembly structure, and engages with the screw fixing hole 315 in the tri-face cover 30 in the side cable lead assembly structure.

The tri-face cover 30 is formed of an intermediate (or central) face part 301 and face parts 302 and 303 in two sides, to have a rectangular U-shaped cross section. End edges of the rectangular U-shaped cross-section at one end portion are in the same plane as each other. Another end edge of the intermediate face part 301 is protruded (extended) from the end edges of the two sides. The protruded face part (extended part) 304 forms a cover of an extended part 402 (connector container chamber 6) and a mount piece (a piece fixed with screws to the connector metal, bracket 40) of the connector metal bracket 40.

The screw fixing hole 311 is cut at a corner of the intermediate face part 301 of the tri-face cover 30 on one end edge in a side of the face part 303. Screw fixing holes 312 and 313 are cut at two corners of the intermediate face part 301 of the tri-face cover 30 on another end edge, Of the face parts 302 and 303 in the two sides, a screw fixing hole 314 is cut at a corner of the face part 302 in a side of the face part 301, and a screw fixing hole 315 is cut at an end of the face part 303 in the side of the another end edge. Termination ends of the face parts 302 and 303 in the side of the one end edge in two sides of the tri-face cover 30 form notch parts 316 and 317 which engage with engaging pieces 202 and 203 provided on the board mount frame 20.

The screw fixing hole 311 is fixed with a screw to the screw fixing piece 104 in the lens mount 10 in the back cable lead assembly structure, and is fixed with a screw to the screw fixing piece 204 on the board mount frame 20 in the side cable lead assembly structure. The screw fixing holes 312 and 313 are fixed with screws to the screw fixing pieces 406 and 407 on the connector metal bracket 40. The screw fixing hole 314 is fixed with a screw to the screw fixing piece 105 on the lens mount 10 in the back cable lead assembly structure, and is fixed with a screw to the screw fixing piece 201 on the board mount frame 20 in the side cable lead assembly structure.

The connector metal bracket 40 comprises a mount piece 401, and forms the connector container chamber 6 which contains a body part (connector body) 501 of the external interface connector 50 in the extended part 402.

A screw fixing hole 411 is cut in the bracket fixing piece 401. The screw fixing hole 411 is fixed with a screw to the screw fixing piece 204 of the board mount frame 20 in the back cable lead assembly structure, and is fixed with a screw to any of the screw fixing pieces 104, 105, 106, and 107 in the side cable lead assembly structure. The extended part 402 extended from the bracket fixing piece 401 forms a support frame part of a connector. The extended part 402 is provided with a connector terminal lead hole 403 in an extended face parallel to a mount face of the bracket fixing piece 401, and leads the external connection terminal 502 of the external interface connector 50 to outside. Connector support parts 404 which engage with and support a connector body 501 are provided in two sides of the connector terminal lead hole 403. Screw fixing pieces 406 and 407 which fix, with screws, the screw fixing holes 312 and 131 provided in a protruded face part 304 of the tri-face cover 30 are provided in an extended end of the extended part 402.

The external interface connector 50 is fixed to the connector metal bracket 40 by a pair of clamp screws 41 with lock terminals. The clamp screws 41 with lock terminals (terminals) each comprise a plug-clamp lock terminal for fastening a plug (connector) to the external connection terminal 502 when a connection plug (connector) of an unillustrated external interface cable is interface-connected to the external connection terminal 502 of the external interface connector 50. The external interface connector 50 forms a camera link connector according to a camera link standard.

The imaging chamber 2 formed in the box-type camera housing 1 having a four-piece structure as described above contains a lens mount built-in module 3 which forms a sensor module, and a frame built-in module 4 which forms a control module. A body part 501 of the external interface connector 50 is contained in the connector container chamber 6 which communicates with the imaging chamber 2 and is formed in the extended part 402. The connector metal bracket 40 and the external interface connector 50 attached to the connector metal bracket 40 form a connector module 5.

The lens mount built-in module 3 which forms the sensor module is comprised of a lens mount 10, an O-ring 11, a shim 12 for adjusting a flange back, a solid-state imaging element 13, a device holder 14, and a sensor board (rigid board) 15. The solid-state imaging element 13 comprises a rectangular imaging plane 13 a, which forms an area image sensor. The device holder 14 holds the solid-state imaging element 13. The sensor board (rigid board) 15 mounts the solid-state imaging element 13 through the device holder 14.

Among constitutive elements of the lens mount built-in module 3, the solid-state imaging element 13 is a charge-coupled device (CCD) or complementary metal oxide semiconductor (CMOS) image sensor. In the present embodiment, the CCD is employed as the solid-state imaging element 13, and the CCD 13 is mounted on the sensor board 15 by the device holder 14. The CCD 13 is fixed to and supported on the sensor board 15 with its position adjusted by the shim 12 in a manner that the rectangular imaging plane 13 a is located at a position where a flange back on the optical axis O1 is maintained. The shim 12 for adjusting the flange back is appropriately used upon necessity in optical adjustment work, and is not equipped in some cases. The flange Pack (FB) is determined by a distance (flange focal length) to a focus (imaging plane 13 a) from, as a reference, an open end (flange face of a lens) of the imaging window 101 provided on the lens mount 10.

The lens mount built-in module 3 is configured by fixing the sensor board 15, which mounts the CCD 13 by the device holder 14, with screws to the lens mount 10, with the ring 11 and shim 12 inserted therebetween and with the device holder 14 used as a fixing/support member.

The frame built-in module 4 which forms a control module is comprised of the board mount frame 20, a control board (rigid board) 21, and a power supply board 22. The control board 21 and the power supply board 22 are layered on each other, are physically integrated by columnar solder balls SB (barrel-type resin core solder balls), and are circuited and connected to each other, forming a package-on-package (POP) board having a double-board structure. The POP board using the barrel-type resin core solder balls SB will be described later with reference to FIGS. 16, 17A, and 17B.

The POP board comprised of the control board 21 and the power supply board 22 is fixed with a screw to the board fixing piece 205, and is supported by and fixed to the board mount frame 20, with the control board 21 and power supply board 22 standing on a surface of the board mount frame 20. In this manner, the frame built-in module 4 forming the control module is constructed.

The connector module 5 and the frame built-in module 4 as described above are circuited to each other to be connectable and disconnectable through a connector by a connector-connection flexible printed wiring board (external interface flexible printed wiring board) 23. The frame built-in module 4 and lens mount built-in module 3 are circuited to each other to be connectable and disconnectable through a connector by a sensor circuit flexible printed wiring board 25. The external interface flexible printed wiring board 23 comprises an IC component 24 provided thereon for signal processing. The sensor circuit flexible printed wiring board 25 has a length which allows the frame built-in module 4 and connector module to be folded multiple times to the lens mount built-in module 3, pivotally about a vertical axis parallel to the optical axis O1.

FIGS. 5A, 5B, 6A, 6B, 7A, 7B, 8A, 8B, 9A, and 9B show built-in states of the back cable lead assembly structure and the camera assembly structure, and exterior configurations before and after building the structures in the camera assembly structures described above.

FIG. 5A shows a built-in state in which the connector module 5 is provided on the back face (rear face) part of the box-type camera housing 1. FIG. 5B shows an exterior configuration thereof after being built in. In this assembly structure (in the case of an assembly structure in which an external interface cable is led from the back face part), the board mount frame 20 forms a bottom part of the camera housing 1.

FIG. 6A shows a built-in state in which the connector module 5 is provided on the top face (rear face) part of the box-type camera housing 1. FIG. 6B shows an exterior configuration thereof after being built in. In this assembly structure (in the case of an assembly structure in which an external interface cable is led from the top), the board mount frame 20 forms the bottom part of the camera housing 1, as in the assembly structure shown in FIGS. 5A and 5B.

FIG. 7A shows a built-in state in which the connector module 5 is provided on a lower face part of the box-type camera housing 1. FIG. 7B shows an exterior configuration thereof after being built in. In this assembly structure in the case of an assembly structure in which an external interface cable is led from the lower face), the board mount frame 20 forms the top part of the camera housing 1.

FIG. 8A shows a built-in state in which the connector module 5 is provided on a left side face part of the box-type camera housing 1. FIG. 8B shows an exterior configuration thereof after being built in. In this assembly structure (in the case of an assembly structure in which an external interface cable is led from a left side face), the board mount frame 20 forms a right side face part of the camera housing 1.

FIG. 9A shows a built-in state in which the connector module 5 is provided on a right side face part of the box-type camera housing 1. FIG. 9B shows an exterior configuration thereof after being built in. In this assembly structure (in the case of an assembly structure in which an external interface cable is led from a right side face), the board mount frame 20 forms a left face part of the camera housing 1.

FIGS. 10A, 10B, 11A, 11B, 12A, and 12B show an assembly procedure for assembling the hack cable lead assembly structure described above. FIGS. 13, 13B, 14A, 14B, 15A, and 15B show an assembly procedure for assembling the side cable lead assembly structure.

In the assembly procedure for assembling the back cable lead assembly structure, cushion materials C5 are bonded to two surfaces of the IC component 24 mounted on the external interface flexible printed wiring board 23, as shown in FIG. 10A. Thereafter, the external connection terminal 502 of the external interface connector 50 to which the external interface flexible printed wiring board 23 is soldered is led to outside of the connector container chamber 6 through the connector terminal lead hole 403 of the connector metal bracket 40. The external interface connector 50 is fixed to the connector metal bracket 40 by the clamp screws 41 with the lock terminals, thereby forming the connector module 5. Further, as shown in FIG. 10B, the external interface flexible printed wiring board 23 is connected by a connector to the control board 21 of the frame built-in module 4.

Subsequently, the external interface flexible printed wiring board 23 to which the frame built-in module 4 and connector module 5 are circuited and connected is folded as shown in FIGS. 11A and 11B, and the connector metal bracket 40 is engaged with the board mount frame 20. Thereafter, as shown in FIG. 12A, the lens mount built-in module 3 is built in the frame built-in module 4. The tri-face cover 30 is fixed with screws to the lens mount built-in module 3, frame built-in module 4, and connector module 5, with the cushion materials C1, C2 inserted. In a step of building the lens mount built-in module 3 into the frame built-in module 4, the sensor circuit flexible printed wiring board 25 is folded and contained between the sensor board 15 and the control board 21, as shown in FIGS. 3A and 5A.

In this manner, the small industrial electronic imaging camera having the hack cable lead assembly structure as shown in FIG. 12B is constructed (see FIG. 5B).

In the assembly procedure for assembling the side cable lead assembly structure, as shown in FIG. 13A, the external connection terminal 502 of the external interface connector 50 to which the external interface flexible printed wiring board 23 is soldered is led to outside of the connector container chamber 6 through the connector terminal lead hole 403. The external interface connector 50 is fixed with the clamp screws 41 with lock terminals to the connector metal bracket 40, thereby forming the connector module 5. Between the side cable lead assembly structure and the back cable lead assembly structure, directions of the external connection terminal 502 to be inserted into the connector terminal lead hole 403 are vertically reversed to each other in relation to the connector terminal lead hole 403. Further, as shown in FIG. 13B, the external interface flexible printed wiring board 23 led from the connector module 5 is connected by a connector to the control board 21 of the frame built-in module 4, and cushion materials C4 are bonded to the power supply board 22.

Subsequently, the external interface flexible printed wiring board 23, which circuits and connects the frame built-in module 4 and connector module 5, is folded as shown in FIGS. 14A and 14B. As shown in FIG. 15, the lens mount built-in module 3 is built in the frame built-in module 4. The tri-face cover 30 is fixed with screws to the lens mount built-in module 3, frame built-in module 4, and connector module 5. In this assembly step, depending on which of right, left, upper, and lower side faces of the camera housing 1 the external interface connector 50 is to be provided on, the frame built-in module 4 is pivoted in units of 90 degrees about a vertical axis parallel to the optical axis O1 (see an arrow direction in the figure), to form a desired side cable lead assembly structure. In this case, the sensor circuit flexible printed wiring board 25 has a length which allows the board 25 to be folded multiple times. With the lens mount built-in module 3 and frame built-in module 4 circuited and connected, the cable lead direction of the camera housing 1 can be arbitrarily changed to any of the right, left, upper, and lower side faces.

On a surface of the board mount frame 20 forming a face part of the camera housing 1, the control board 21 and power supply board 22 are supported to stand as the POP hoard. In any of the back cable lead assembly structure and side cable lead assembly structure. The POP hoard described above is mounted in the same array as the sensor board 15 built in the lens mount built-in module 3 in a manner that these hoards are layered on each other. Therefore, a board mount space for the imaging chamber 2 can be suppressed to minimum.

Further, a structure of the POP board is configured to be robust against thermal deformation and pressure deformation by using barrel-type resin core solder balls SB, without connecting the control board 21 and power supply board 22 by a connector. In this manner, a circuit connection is achieved, maintaining the control board 21 and power supply board 22 stable for a long period, and the boards are integrated rigidly at a set constant gap.

The sensor board 15, control board 21, and power supply board 22 can be mounted in the imaging chamber 2 of the microcamera housing 1 of an approximately 20 mm cube by a same-array mount means for mounting the sensor board 15 and POP board in the same array in both of the back cable lead assembly structure and side cable lead assembly structure, and by the POP board structure using the barrel-type resin core solder balls SB.

FIGS. 16 and 17A show the POP board structure of the control board 21 and power supply board 22, which uses the barrel-type resin core solder balls. In the control board 21, an active circuit component P1 which generates heat during operation is mounted on a board face of the control board 21, which is opposed to the power supply board 22. On a pattern forming face of the power supply board 22 which is opposed to the control board 21, barrel-type resin core solder balls SB are arrayed on both sides of a face part opposed to the active circuit component P1, avoiding the surface part facing with the active circuit component P1. The power supply hoard 22 and control board 21 are soldered to each other by a solder re-flow processing. In this manner, the control board 21 and power supply board 22 are integrated and circuited to each other by the barrel-type resin core solder balls SB, with the solder balls SB arrayed on both sides of the active circuit component P1 mounted on the control board 21. Thus, the POP board having a double-board structure is manufactured. P2 shown in FIG. 17A denotes circuit components mounted on a component mount face of the control board 21, and P3 denotes circuit components mounted on a component mount face of the power supply board 22.

In the POP board having a double-board structure configured by the control board 21 and power supply board 22, barrel-type resin core solder balls SB are arrayed on both sides of the active circuit component P1. A gap (hr) can be formed at a constant clearance (gb) by setting a greater dimension (ga) of the barrel-type resin core solder balls SB in a height direction vertical to the board face than a height of the mounted active circuit component P1. In an actual device, barrel-type resin core solder balls SB having ga=1.5 mm are used to form the gap (hr) having gb=0.3 mm. The gap (hr) contributes to forming of a waste heat path which guides heat generated from the active circuit component P1 to the barrel-type resin core solder balls SB arrayed on both sides of the active circuit component P1.

FIG. 17B shows the POP board structure when active circuit components each of which generates heat during operation are mounted on the mutually opposed faces of the control board 21 and power supply board 22. Here, an active circuit component Pa is mounted on the control board 21 and a circuit component Pb is mounted on the power supply board 22. In this case, the dimension (ga) of the barrel-type resin core solder balls SB in the direction vertical to the hoard face is set to be a greater value than a total of actual heights of the active circuit component Pa and circuit component Pc. A gap (hr) of a constant clearance (gd) can be thereby formed between upper faces of the active circuit component. Pa and circuit component Pc. Pb shown in FIG. 17B denotes circuit components mounted on a component mount face of the control board 21, Pd denotes circuit components mounted on a component mount face of the power supply board 22, and gb denotes a gap formed between the upper face of the active circuit component Pa and the board face of the power supply board 22. gc denotes a gap formed between the upper face of the circuit component Pc and the board face of the control board 21.

As has been described above, according to the embodiment of the invention, a mount face for an external interface connector can be set and changed to an arbitrary face (back face, right side face, left side face, upper side face, or lower side face) among five faces of a box-type camera housing except a front face part (lens mount) thereof. In this manner, an external interface cable from the camera housing can be led in an arbitrary direction among five directions as targets, i.e., a back leading direction parallel to an optical axis of the camera, a right, left, upper, and lower leading perpendicular to the optical axis of the camera. In this manner, there is provided a small industrial electronic imaging camera comprising a connection mechanism for an external interface cable with high general versatility, wherein the camera can by easily assembled with a leading direction of the external interface cable arbitrarily selected, in an economically advantageous configuration.

Also, there is provided a small industrial electronic imaging camera which can integrate camera functions by containing, in an imaging chamber in a camera housing, a control board for controlling a sensor board, and a power supply board for supplying and controlling an operation power for the sensor board and control board, and can be expected to achieve highly reliable circuit operation.

The present invention is not limited just to the embodiment described above but various camera assembly structures can be achieved by modifying constitutive elements without deviating from the spirit of the invention.

REFERENCE SIGNS LIST

-   1 . . . Camera housing, 2 . . . Imaging chamber, 3 . . . Lens mount     built-in module, 4 . . . frame built-in module, 5 . . . Connector     module, 6 . . . Connector container chamber, 10 . . . Lens mount, 11     . . . O-ring, 12 . . . Shim, 13 . . . Solid-state imaging device     (CCD), 14 . . . Device holder, 15 . . . Sensor board, 20 . . . Board     mount frame, 21 . . . Control board, 22 . . . Power supply board, 23     . . . External interface flexible printed wiring board, 24 . . . IC     component, 25 . . . Sensor circuit flexible printed wiring board, 30     . . . Tri-face cover, 40 . . . Connector metal bracket, 41 . . .     Clamp screw with lock terminal, 50 . . . External interface     connector, 101 . . . Imaging window, 102 . . . Lens frame part, 103     . . . To mark, 401 . . . Bracket fixing piece, 402 . . . Extended     part, 403 . . . Connector terminal lead hole, 501 . . . Body part     (connector body), 502 . . . External connection terminal, 503 . . .     Connection end surface, O1 . . . Optical axis, SB . . . Columnar     resin core solder ball having a swollen center part (barrel-type     resin core solder ball) 

1. A small industrial electronic imaging camera comprising: a box-type camera housing having a hexahedral structure in which an external interface connector can be attached to an arbitrary face part among a plurality of face parts as targets except a front face part formed by a lens mount; a sensor board which is contained in an imaging chamber formed in the camera housing and mounts a solid-state imaging element; a control board which is contained in the imaging chamber and controls driving of the solid-state imaging element mounted on the sensor board; and a power supply board which is contained in the imaging chamber and controls supply of an operation power to the sensor board and control board, wherein the control board and the power supply board form a POP board having a double board structure in which the control and power supply boards are integrally connected and circuited to each other by soldering by a plurality of resin core solder balls having a columnar shape whose center part swells, with a predetermined gap maintained between mutually opposed board faces of the control and power supply boards.
 2. The small industrial electronic imaging camera according to claim 1, wherein the camera housing comprises: a lens mount which comprises an imaging window and forms the front face part of the box-type camera housing having the hexahedral structure; a tri-face cover having a rectangular U-shaped cross-section which can be attached to the lens mount with edges switched in relation to edges of the lens mount about a vertical axis parallel to an optical, axis of the imaging window, and forms arbitrary three side face parts of the camera housing or forms arbitrary two side face parts and a back face part of the camera housing; a board mount frame which comprises a board mount mechanism containing and supporting a plurality of boards in an imaging chamber formed in the camera housing, and is attached to the lens mount thereby forming an arbitrary side face part of the camera housing; a connector metal bracket which is attached to the lens mount and forms an arbitrary side face part or the back face part of the camera housing; and an external interface connector which comprises an external connection terminal for connecting an external interface cable, and is attached to the connector metal bracket, with the external connection terminal exposed to outside, wherein the sensor board is supported by the lens mount; the POP board is supported by the board mount mechanism, and the sensor board and the POP board are contained in the imaging chamber.
 3. The small industrial electronic imaging camera according to claim 1 or 2, wherein in the POP board, an active circuit component is mounted on one of the mutually opposed board faces, and a constant clearance is formed by the resin core solder balls between an upper face of the active circuit component and the other one of the mutually opposed hoard faces.
 4. The small industrial electronic imaging camera according to claim 3, wherein on the POP board, the resin core solder balls are provided on both sides of the active circuit component, and the gap forms a waste heat path which guides heat generated from the active circuit component to the resin core solder balls.
 5. The small industrial, electronic imaging camera according to claim 1 or 2, wherein the sensor board and the POP board are circuited to each other to be connectable and disconnectable by a sensor circuit flexible printed wiring board having a length which allows the board to be folded multiple times in a manner that the POP board is pivotally and relatively provided to the sensor board, about a vertical axis parallel to an optical axis of the lens mount. 